Diversification and Securing the U.S. Global Semiconductor Supply Chain
Diversification and Securing the U.S. Global Semiconductor Supply Chain
Tuesday, November 19, 2024 at 4pm (arrive), 4:15 Panel; 5:30pm Networking
At ASU Thunderbird School of Global Management
One Global Place, 401 North 1st Street, Phoenix, Arizona 85004
RSVP to Thomas Maynard here
The panel will discuss introduce the ITSI project and the international delegation from Vietnam, Philippines, and Costa Rica will present their national semiconductor roadmaps and vision to establish bi-lateral partnerships followed by an interactive discussion with the audience. A networking reception will follow the event.
As part of the U.S. Chips and Science Act, the International Technology Security and Innovation (ITSI) Fund, appropriated under the Creating Helpful Incentives to Produce Semiconductors (CHIPS) Act of 2022, provides the Department of State with $500 million — $100 million per year over five years to promote the development to ensure the semiconductor ATP supply chain security and diversification.
In February 2024, The U.S. Department of State’s Bureau of Economic and Business Affairs awarded a 2-year, $13.8 million cooperative agreement to ASU under the International Technology Security and Innovation (ITSI) Fund, to diversify the global semiconductor supply chain. The project objective is to bolster the assembly, testing, and packaging (ATP) capabilities in ITSI partner countries in the Americas (Mexico, Costa Rica, and Panama) and Indo-Pacific (Indonesia, Philippines, and Vietnam), enhancing a resilient supply chain for U.S. semiconductor manufacturers.
Speakers:
Mr. Rob Garverick, Deputy Assistant Secretary, Bureau of Economic and Business Affairs, US Department of State
Ms. Indiana Trejos, Vice Minister, Ministry of Foreign Affairs, Costa Rica
Mr. Juan Angara, Secretary, Department of Education, Philippines
Mr. Nguyen Duc Huy, Deputy Section Head, Ministry of Foreign Affairs, Vietnam
Moderator: Mr. Thomas Maynard, Senior Vice President, GPEC


