Advanced Packaging Summit by JCCIAZ

Advanced Packaging Summit in Arizona 2026

“The Key to the Growth of Global Generative AI Servers Lies in Japanese Materials and Packaging Technologies”

This summit will bring together leading experts in advanced semiconductor packaging to discuss the latest technology trends and future market outlook, with a particular focus on materials, substrates, and advanced packaging solutions that are critical in the AI era.

Due to limited seating, early registration is highly recommended.

Global Chamber is pleased to be a marketing partner.

Event Overview

• Date: Monday, March 2, 2026
• Venue: Sheraton Grand at Wild Horse Pass
  

Registration Fee

• JCCIAZ Member Companies: $50 per person
• Non-Member Companies: $150 per person
• Number of participants: No limit per company

---> Register HERE